Solderstar Unveils Reflow Shuttle O2 Measurement Module
Solderstar Reflow Shuttle O2 measurement module is a repeatable verification tool that combines O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed on a single platform.
Offers real-time control over oxygen content to aid in the elimination of oxidation issues that could impact soldering quality. Detection nitrogen leaks throughout oven zones and pinpoints oxygen fluctuations. Reportedly seamlessly integrates into a fully operational reflow oven, eliminating downtime during verification. With a button press, manufacturers can initiate data collection, obtaining a comprehensive pass-through graph of the entire oven, complete with insights into anomalies at the outset of the process, facilitating rapid adjustments if necessary. Custom battery pack enables multiple passes across various production lines before recharging is required. Smartlink connector provides quick connections to SLX datalogger. The Shuttle is auto-configured without computer setup, for both initial setup and daily process checks on production floors.
Solderstar
