TRI Launches High Performance 3-D SPI Solution
Published: 16 August 2023
TRI's TR7007Q SII is a state-of-the-art 3-D SPI system designed to maximize production efficiency.
Delivers up to 50% faster inspection compared to previous models and is equipped with a 9.8μm high-resolution 21MP camera to deliver enhanced measurement accuracy and stability. Can also effectively inspect bumps, flux, mini LED solder and bare boards. Improved accuracy and stability enable precise solder measurements and minimize false calls, and is equipped with a wide spectrum light system and coaxial lighting to provide higher contrast, exceptional clarity and uniformity to improve detection rates.
Test Research, Inc.
