Henkel's Bergquist Hi Flow THF 5000UT phase change film TIM allows for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface.

Ideal for challenging package designs with complex architectures, such as lidless multi-chip devices used in high-performance compute and industrial applications. Demonstrates low thermal impedance across various bond line thicknesses at both ultra-low and higher pressure (0.04° C-cm2/W at 35psi, 0.06° C-cm2/W at <10psi), delivers excellent reliability as evaluated up to 150° C, and achieves thermal conductivity as high as 8.5 W/m-K. Provides heat sink suppliers with no-mess, easy application and integrators with simple final assembly, and film medium – as opposed to liquid materials – allows for application before shipment. Does not require pre-burn before use.

Henkel

www.henkel.com 

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