Sustained ring soldering module permits preassembled solder rings to be placed on and around THT pins, which are then melted by laser, piston or induction soldering, or IR emitters, hot air or thermodes.

Fully automatic ring production device produces specific solder rings from solder wires, with or without flux core. Solder wires of different diameters can be bent with specific ring diameters. Solder rings can be positioned manually with aid of tweezers and magazine dispensers or automatically by pick-and-place handling on solder joints to be soldered or over plated-through pins. No gate necessary; reportedly processes almost 100% of solder wire roll. Integrates with soldering module in E-cell. In case of narrow pins, solder rings are flattened or oval-shaped in wire diameter. Placement of solder rings is decoupled from actual soldering process; both individual steps can be performed simultaneously.

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