Heraeus Develops Microbond SMT650 Solder Paste
Published: 25 April 2019
Microbond SMT650 solder paste offers high surface resistance.
Is tin-silver-copper alloy (SAC) compatible with protective lacquers for electronics and PCBs. Combination of F650 flux with Innolot metal alloy increases reliability and prevents electrochemical migration. Innolot contains various metals that increase electronics service life through high thermomechanical stability.
Heraeus Electronics
heraeus.com
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