caLogo

2Di-LU1 inline bottom-side AOI system captures entire image of 460 x 500mm PCBA and carriers of 610 x 610mm in one pass in real time.

Stores image into memory and creates inspection data for entire board. Automates bottom-side inspection process, eliminates board flipping and handling, and ensures quality after potting, dip, wave, and selective soldering processes. Software includes Fujiyama algorithm, which provides through-hole joint inspection. Inspects for copper exposure, pin detection, pin-holes, solder fillet abnormalities, missing components, soldering problems, and bridges. Supports L-size PCBs, high clearances, heavy substrates, and mounted jigs.

Saki 2DILUI web

Saki Corp.
sakicorp.com

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account