Loctite GC 18 is a low-voiding solder paste designed for use with multiple component sizes and types, including large, thermally challenged devices such as MOSFETs, LPBGAs, QFNs and large array components.

Is available in Type 3 and Type 4 pastes and is halogen-free and Pb-free. Is stable for one year when stored at 26.5°C and for one month in temperatures up to 40°C. Has high Cpk during continuous printing and after four hours of abandon time. Is compatible with surface finishes such as OSP- and Ni/Zn-coated copper and HASL. Exhibits low void incidents with 0201 chip resistors and capacitors, 0.4mm pitch BGAs, SOICs, QFPs and QFNs measuring >10mm x 10mm.

Henkel
henkel-northamerica.com

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