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CA-188-1 low-temperature cure electrically conductive adhesive is for die attach and general circuit assembly applications.

Cures in 30 min. at 80°C, 20 min. at 100°C or 30 sec. at 150°C with an electrical conductivity of 2 x 10-4 ohm-cm. For applications where the are temperature-sensitive and require high conductivity interconnects. Has a 48-hr. work-life and a 11,000 cP viscosity at 5rpm for easy needle dispensing or application by pin transfer. Meets reliability requirements for die attach, disk drive, camera module, photonics and circuit assembly applications.

Engineered Materials Systems

emsadhesives.com


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