Alpha PowerBond solder preforms are for high-temperature, high-reliability, lead-free interconnects for automotive and power semiconductor applications.

Contain approximately 5-10% Antimony (Sb). Can be customized with TrueHeight preforms for bond-line thickness and tilt control or can be pre-coated with AccuFlux, an ultra-low voiding flux formulation. PowerBond 2110 preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity. PowerBond 2100 preforms provide high creep resistance and tensile strength for high operating temperature applications. PowerBond 2050 preforms expand on industry standard Sn95Sb5 alloy to provide improved wetting characteristics.

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