Type AuR gold ribbon bonding wire is fabricated to 4N specifications with 99.99% purity using a dry process.

Sizes range from 12.7µm to 50µm thickness. Widths range from 25µm to 250µm. Is typically packaged on 2" high-purity ribbon spools with lengths up to 100m. Is produced using a rolled process with stress relief. Edges are smooth. Is reportedly ideal for RF devices, high-reliability applications and high-power applications such as laser and microwave devices.

Tanaka Precious Metals
pro.tanaka.co.jp/en

 
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