Indium11.8HF-SPR solder paste can be reflowed in air and nitrogen.

No-clean, Pb-free Type 5 solder meets fine-feature printing requirements of mobile manufacturers. Offers stencil print transfer efficiency through small apertures (≤0.66 area ratio) on a range of processes. Is halogen-free per IEC 61249-2-21 test method EN14582. Stencil life >12 hr. Is said to eliminate hot and cold slump to inhibit bridging and solder beading defects. Avoids potential for HiP and graping defects with a unique oxidation barrier.


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