YSi-SP 3D solder paste inspection machine is based on “1-head solution” concept.

Inspects printing quality (volume, height, area, and misalignment) of solder paste after it has been printed onto printed circuit boards. Employs algorithm combining 2D and 3D-based measurements and image resolution switch-over using high-res technology. Coordinates with other Yamaha machines to perform automatic setup changes, automatically adjust solder misalignment, and automatically convert adhesive inspection data from dispenser. Offers statistical process control (SPC) to perform a range of statistical processing. Optional features include bonding inspection and foreign matter inspection.

Yamaha Motor IM

 Yamaha YSi SP web

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