S3088 Ultra Chrome 3D AOI has been streamlined for large series production, with high throughput thanks to a new high-speed camera module.

Measures several height profiles on solder meniscus with 10µm resolution and depicts them as easy-to-interpret values. Inspects paste with CSPs or µBGAs and prints for pad sizes of 01005 chips at speeds up to 200 cm²/s. Different camera configurations permit flexible use with and without 3D inspection. Virtually shadow-free 3D inspection, to attain uniform inspection of components of the same type on the assembly. Inspects dewetting on QFPs and typical defects on QFNs and DFNs. FastFlow handling available for PCB changeover in as few as 2.5 sec. Can be intelligently networked for Industry 4.0 via novel Quality Uplink.



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