Dual-VU inspection system delivers magnified real-time x-ray and optical component images simultaneously and at the same level of magnification. Can make direct, simultaneous comparisons between optical and x-ray images of a complex component. Reportedly reveals hidden solder bridges, voids and surface problems on BGAs in one pass. Simultaneously verifies solder joint integrity and placement accuracy of leaded IC components. Views component surface and interior at the same magnification, usually 15X. In failure analysis, signal traces on multilayer boards can be identified visually and tracked. Confirms electrical continuity of plating after drilling.
Glenbrook Technologies,
www.glenbrooktech.com
