Vitronics Soltec Enhances mySelective 6745, XPM3 Soldering Equipment
Published: 18 March 2010
mySelective 6745 selective soldering machine now features a new parallel processing design and dual-soldering nozzles said to nearly double throughput. Setup is quick using the Easyteach2 program.
XPM3 reflow oven now has an AUTOset fast setup feature capable of generating a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes an optimized profile from the preliminary recipe if needed. Reportedly, 85% of the time, modification of the auto-created profile is not necessary.
AUTOset controls ramp-up heating rate, thermal soak, time above liquidus, peak temperature, and total heating time.
Vitronics Soltec, www.vitronics-soltec.com
