The SE500 series 100% 3-D solder paste inspection system reportedly has the ability to inspect assemblies at greater than 70 to 80 cm2 /sec. speeds. Inspect pad sizes down to 01005 (150 x 150 µm). Comes in two models, to accommodate different panel sizes. Features a conveyor that can transport panels from 50 x 50 mm to 510 x 510 mm. SE500X can transport panels from 100 x 100 mm to 810 x 610 mm. Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and process tracker SPC charts with alarm capability in the operator user interface. Has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output. Can run program files originally created for SE 300 Ultra.
 
CyberOptics Corporation, www.cyberoptics.com

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