Ablestik brand die attach materials known as self-filleting die attach use capillary force to control flow and deliver complete wetting. A dot is deposited and the die placed; capillary force then draws it out to the edge of the die where it forms a small fillet. No excessive placement force is said to be required. Available in Ablestik AAA3300 non-conductive paste for die to substrate laminate-based devices; Ablestik AAA3320 non-conductive material for die to die attachment, and Ablestik 3900 conductive adhesive designed for die to substrate leadframe packages.

Henkel Corp., www.henkel.com/electronics