LFM 48 N is a no-clean, Pb-free alternative to gel pastes traditionally used in BGA PoP stacked device applications. Is for holding larger area devices that often exhibit warpage during reflow. Combines ultra-fine solder spheres and a low-voiding, thermally stable flux vehicle. Formulation comprises SAC 305 with a solder powder size of 4 to 24 µm. Features reported open time in a dipping tray 8 hrs. at 23°C and 50% RH, and up to 8 hrs. process window time between dipping and reflow.

Almit Ltd., www.almit.com

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