New Products
AOX755 flux-filled high-performance solder wires are based on two soft solder alloys filled with three cores of flux compound EO-FC-006.
Etimol defoamer DFL-100 and DFL-C anti-foaming agents can be used in machine-based cleaning to prevent uncontrolled foam development.
1911MK5-VR Nitrogen Vacuum Reflow Oven has 11 zones, a vacuum chamber, closed-loop nitrogen atmosphere control and Cool-Pipe flux management system, which traps flux so it can be removed and replaced while oven is running.
YRM20 high-speed modular mounter features high-speed rotary head that achieves up to 115,000cph.
PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.
Press Releases
- PARMI Enhances Support for Brazilian Electronics Manufacturers with New Local Partnership
- ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
- BMK strengthens its coating expertise for electronic assemblies with a technology initiative
- Altus Group Strengthens Leadership with New Operations Director