New Products
Shenzhen Deepmaterial Technologies' latest range of advanced adhesive solutions includes its One Part Epoxy Adhesive, Two Part Epoxy Adhesive, and Magnet Bonding Adhesive.
Hirose's BM56 Series multi-RF board-to-board connector provides a size reduction of up to 71% compared to conventional designs.
Yincae's UF 120HA material is designed to provide a fast flow, lower-temperature cure for high-throughput application.
Vishay Intertechnology's four new series of 200V FRED Pt ultrafast rectifiers are provide space-saving, high efficiency solutions for commercial, industrial, and automotive applications. The 1A VS-1EAH02xM3, 2A VS-2EAH02xM3, 3A VS-3EAH02xM3, and 5A VS-5EAH02xM3 are each available in Vishay Automotive Grade, AEC-Q101 qualified versions.
Kurtz Ersa's Auto Scavenger Module is an extension for the Ersa HR 600 XL rework platform that is designed to enhance the efficiency and effectiveness of non-contact removal of residual solder from circuit boards.
Hernon Manufacturing's Ultrabond Sealant 721 is a UV curable adhesive designed to deliver exceptional sealing capabilities for a wide range of plastics.
Press Releases
- Transition Automation Ships Largest Single Order in Company History; Mark Curtin Comments
- Henkel wins Texas Instruments 2024 Supplier Excellence Award; Wen Zhou Comments
- “Chill Out” with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
- Green Circuits Expands Large-Format PCBA Capabilities with Installation of JUKI Primo Screen Printer; Michael W. Hinshaw, Jr. Comments