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New Products

Thermoset SC-303, SC-309 and SC-320 thermally conductive silicone encapsulants are designed for thermal conductivity for electrical/electronic encapsulating applications. Are two-component systems designed to retain properties associated with silicones. Exhibit low shrinkage and stress on components as they cure, and maintain low viscosity. Are environmentally resistant and UL-rated; are composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Lord Corp., www.lord.com/electronicmaterials

Selective Stamp Soldering involves fitting a selective soldering machine with a custom stamp soldering nozzle with several aperture indexes around from board to board. Stamp solders small patterns on each printed circuit board. Is reportedly faster than a single nozzle selective soldering routine. Reportedly requires no modifications to selective soldering machine. Nozzle can be removed and exchanged with a standard nozzle. Processes every board in the panel in the same fashion. Has a small multi-port nozzle. A small pattern involving a connector and three other devices takes about 6 to 7 sec.

ACE Production Technologies, www.ace-protech.com

PVA710 dispenses optical bonding adhesives and assembles optical devices in atmosphere without bubbles. For use with optically clear acrylics or silicones. Provides dam and seal dispensing and curing, fill dispensing and cover placement. Applications include bonding touchscreen to LCD, cover glass to LCD, etc. Employs a gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback. The cover glass trunnion provides an assembly means where the bonded surface is not contacted by the system. Accommodates panels up to 17" at 16:9.

PVA, www.pva.net

EVS 8K LFHS lead-free solder recovery system features improved thermal efficiency, ease of operation, maintenance and environmental management. New software is said to increase solder recovery rates 15 to 20%. "No hinges" door provides greater, easier access when performing cleaning. Loading tray improved. High solids filtration system increases air flow and dust/smoke capture. Comes with LED monitor to indicate filter changes.

EVS International, www.solderrecovery.com

AutoVISION 2.0 machine vision software provides additional capabilities, including verification and OCV (optical character verification) tools to validate print quality, a logic tool for building pass/fail criteria, and support for automated job changeover. Features Microscan Link for connectivity to PLCs and other industrial control systems. Supports Vision Mini and Vision Hawk smart cameras. Has compact, fully integrated or C-Mount designs. Can be upgraded to Visionscape platform.

Microscan, www.microscan.com

PC-9920A UV EPROM/wafer erasing system is for high-volume production. Reportedly has an operating UV intensity up to 60% greater than other systems. Drawer measures 93.3 x 71.1 x 4.4cm; provides for loading of wafers, printed circuit boards, open-faced stocking tubes and metric cards. Adjustable quick load/unload tray inserts can be set to varying heights. Accommodates load capacity of 150mm wafers. PC-9920A-LT system includes light tower; has red/yellow/green signals that indicate the mode status at every stage of operation. Both systems use nine ultra-high intensity, ozone-free, low-pressure mercury vapor quartz grid lamp assemblies. UV grid lamps reportedly increase throughput. Has nominal 254nm irradiance of 70,000 µW/cm² over a 91.4 x 61cm erasing area.

Spectroline, www.spectroline.com 
 

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