Indium9.91 no-clean solder paste is for package-on-package applications 0.3mm and larger. Rheology optimizes dipping and package retention. Reduces defects due to package warping; provides solderability; has long pot life, and provides consistent solder paste volumes. Can be used with SAC 305 and Sn63 alloys.

Indium, www.indium.com

Aquanox A8820 aqueous stencil cleaner is designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. Removes common solder pastes and fluxes; is compatible with stencil cleaning equipment. No-foaming property is compatible with materials used in electronic assembly manufacturing and cleaning processes. Comes in one, five, and 55 gal. containers.

Kyzen, www.kyzen.com

Konform Ultra fast-dry acrylic conformal coating provides insulation protection against high-voltage arcing and corona shorts. Provides a barrier against humidity, salt, corrosive vapors and fungus for printed circuit board and electronic assemblies. Dries quickly. Meets IPC-CC-830B Class B and sections of MIL-I-46058C, type AR. Contains UV indicator. Is compliant with RoHS and REACH.

Chemtronics, www.chemtronics.com

iPAG integrated paste and glue dispenser is for a stencil printer. Includes temperature control and a laser-based distance control. Can apply additional glue or paste depots directly after printing. Size, height and position of points are programmable. Compact heating element with temperature sensing is mounted onto the dispense head. Temperature of material can now be kept constant. Single or Twin iPAG is available. A retrofit is available for XACT 4, X5 Professional and X6 printer models. Reportedly suited for densely populated PCB layouts.

ASYS Group, www.asys-group.com