Indium8.9HF1-P Pb-free solder paste is designed to combine stencil printing, using halogen-free oxidation barrier technology, with no-clean residues for probe testing. Reportedly provides high transfer efficiency and consistent print performance, even at high speeds; lessens need for frequent under-stencil wiping. Prints well on apertures with area ratios <0.5 using low print pressures. Oxidation barrier technology eliminates defects such as head-in-pillow and graping. Has soft residue after reflow; residue remains probe-testable after multiple reflows, time between reflow and test, and baking.
Indium Corp., www.indium.com
LR-T Series multi-purpose laser sensor features a high level of detection ability, with stable detection over long or short distances, regardless of target surface type, color, or finish. Is reportedly not affected by environmental factors like ambient light, mist, or excessive dust. OLED display screen shows all important values needed for setup, calibration and operation. Intuitive menus ease navigation through functions and settings. Large, bright indicator light, visible from any angle, specifies sensor status. Adjustable beam spot and application specific detection modes. IP65/IP67 enclosure rating.
Keyence Corp. of America, www1.keyence.com/PRLRT
Buran B100 screen printer has a print format of 75 x 75mm to 508 x 508mm. Repeatability said to be -/±15μm @ 6 Sigma. Cycle time is 12 sec. (without print). Handles PCB of thicknesses ranging from 1 to 6mm. Single lane conveyor. Optical positioning system consists of two high-resolution cameras: 2D inspection system for post-print and stencil bottom-side control. Automatic programmable stencil cleaning system.
Dial-Electrolux, www.DialElectrolux.ru
MX80 pick-and-place system assembles SMT components from 0201 to 35 x 35mm with a full vision, touchless component centering. Pattern recognition system is easy to use. Built-in intelligent vision system enables picking of bulk (loose) components from container-type feeders or trays. Placement area 325 x 500mm. Has 80 feeder slots for 8 mm tapes + 30 sticks of SO8 - Placement rate 4000 cph. Placement accuracy said to be better than 0.08mm, and X/Y resolution is 5 microns. Linear encoders standard. Automatic fiducial correction and bad mark sensing.
Mechatronika, www.Mechatronika.com.pl
M70 fully automatic SMT placement machine assembly offers flexible Feeding options for bulk components. Optical component centering. Optional fully automatic precision dispenser for solder paste and SMD adhesives. For small to medium volume production. Accepts circuit boards up to 350 x 500mm. Places parts ranging from 0201 to 35 x 35mm and 0.5mm pitch. Has 80 sampling positions for 8mm straps. Placement rate 1,500-1,800 cph. X/Y resolution is 10 microns, and placement accuracy is better than 0.1mm.
Mechatronika, www.mechatronika.com.pl
Moduleclean inline batch cleaning system is for cleaning assembled PCBs, stencils, and other electronics products. Cleans surface mount technology applications such as defluxing of low-residue and Pb-free technology. Options include ultrasonic, spray-in-air, spray-under-immersion, oscillation-under-immersion, and air-under-immersion. Can be designed as a modular system built in various configurations. Features include 100% filtration; rinsing with DI water reclaim; vacuum dryer, and process traceability.
PBT Co., www.pbt.cz