Henkel Relocates Mold Compound Capabilities to CA
Irvine, CA -- The electronics group of Henkel will relocate its mold compound development, application engineering and technical service capabilities from Olean, NY, to the advanced research and applications center in Irvine that opened earlier this year.
Dr. Larry Crane, global director of research, development & engineering for semiconductor materials, said, “With the unification of product development in one facility, Henkel now has the capability to develop our mold compounds, die attach products, thermal interface materials, underfills and encapsulants under one roof with a superior technical team. This streamlined approach is a win-win for everyone, especially customers who can prototype new packages more quickly, accelerate time-to-market and do so more cost-effectively.”
The 53, 000 sq. ft. facility is host to an analytical and failure analysis lab and a 5,000 sq. ft Class 10,000 clean room which houses advanced testing and manufacturing equipment, including a Datacon APS 2200 placement system, a DEK Europa screen/stencil printing system for backside wafer coating and a Disco wafer dicing saw. The operation also has a 2,000 sq. ft surface mount production line with screen printing, reflow and dispensing capabilities.
