EASYpick Trak3 components are said offer increased functionality, improved ergonomic features and advanced diagnostic tools. Hardware developments enable higher productivity and accuracy in order fulfillment operations, compared to conventional pick-to-light systems.
Snap into the track at the pick face with a cable-less connection, for easy reconfiguration. The standard 4" wide pick-to-display and 2" pick-to-light components are compact and permit dense placement and precise alignment with the pick location.
Acknowledgement buttons on the devices are designed for durability and easy response to finger pressure. Pressed buttons will make a connection if any of four touch actuators are engaged. An elastomer keypad design provides reliability and eliminates the possibility of keycaps falling off
Replace the single incandescent gumball picking direction light used in conventional picking units with six small, bright and easily readable LEDs. Depending on function, devices can display red, amber or green lights, and can be set for static illumination or intermittent flash.
Has self-diagnostic tools that can be run at the device and/or the network level, reducing the time required to isolate faulty hardware. Feature embedded device-level software that automatically checks and self-corrects common problems caused by power fluctuations or severed power connections.
The pick-to-light version uses pick lights to indicate bin location and bay displays to indicate picking quantities. Pick-to-light devices, like pick-to-display pick lights, can function in a dual mode controlling an upper and lower location. Also available for left/right location for pallet picking.
FKI Logistex North America, www.fkilogistex.com
The Micro thermal imaging system for microscopic applications consists of the Infrasight thermal imaging camera, microscopic 20 μm lens, optical mounting table, vertical focusing stage, locking xy stage with micrometers, adjustable cooling fan, Dell tower PC with LCD multimedia monitor, required cables and Thermalyze image analysis software.
Optional accessories include a thermal stage and controller, I/O module with eight relay outputs and wide-angle lens (resolution 100 μm to ∞).
The camera obtains the temperature at 19,200 individual points on each image with temperature sensitivity of 0.2˚C for the microscopic lens and 0.1˚C with wide angle lens.
The software provide real-time (30 frames/sec) viewing, automatic emissivity correction and analysis tools to obtain the temperature information needed.
Useful in R&D, design, and troubleshooting applications.
OptoTherm Inc., www.optotherm.com
The company will also showcase its printing platforms for SMT applications, including the Europa as well as the new Horizon variants that integrate the new Instinctiv user interface.
The company will also demonstrate VectorGuard versions of its stencil technologies, including PumpPrint stencils and new electroformed stencils, as well as stainless steel laser cut stencils. VectorGuard stencils are easy and safe to use on the factory floor, store conveniently in a space-efficient filing system and are easily disassembled at end of life.
Güler Basol, the new Product Manager for European Distributed Products (Consumables) division, will also present the regionalised strategy for its consumables business.
DEK, dek.com
EASYLINE 8088 is a die bonder for sensor assembly. Applications include pressure sensors, accelerometers, gyroscopes and other components related to the automotive, biomedical and IT markets. Offers high-volume die bond technology at an attractive price - performance ratio for the sensor and micro assembly market.
Features high-speed air bearing pick-and-place system, closed-loop linear motor pick tool for unbeaten bond line thickness control and fully automatic wafer handling system. To match MEMS and sensor related demands, an active and precise theta control of the bond head is implemented.
Can handle substrates like lead frames, premolded lead frames and ceramics up to 4.5 x 4.5", great for sensor-related die bonding. Allows exact dispensing of epoxies and solder pastes. The closed-lopped linear motor pick tool provides active control of the placement height, for stable bond line thickness. An "open interface" (SMEMA) allows fast adaptation to third party systems or integration into a production line.
Front access to all major systems simplifies the operation. Footprint is 1m2.
Alphasem, alphasem.com
DX-300, with an operating pressure of 0-100 psi, is designed for general fluid dispensing and to control dispensing valves. DX-315, with an operating pressure of 0-15 psi, is designed for low viscosity fluid dispensing. Aside from the different air pressure settings and valve controlling capability, the two are identical in form, fit and function.
Each system is packaged for immediate, out-of-box use, with sample tips, barrels and syringe adapters. Features 10 programmable memories to store and recall the most frequently used dispensing cycle timing.
The memory feature records the time of the dispensing cycle and determines the dispensing time required when dispensing output is unknown. It also works with the built-in "Teach Mode." To control material "tailing" and waste, has an adjustable vacuum and a vacuum-driven "suck-back" feature, monitored by a built-in vacuum gauge.
Footprint is 6 x 6.5 x 7.0" (152 x 165 x 178mm); can be stacked and fastened on top of each other. Full shot time range of 0.008 to 99.999 sec. in 1ms increments and is operational worldwide via a snap-on universal power supply of 100 - 240 VAC, 50 -
60 Hz.
Techcon Systems, techconsystems.com
Isola is launching three new products for the RF and Microwave market, IS640-300 with a nominal dielectric constant of 3.00 at 10 GHz, IS640-320 with a nominal dielectric constant of 3.20 and IS640-325 with a nominal dielectric constant of 3.25.
IS640-300 has a dissipation factor less than 0.0032 at 10 GHz and -320 and -325 have dissipation factors around 0.0035. Available in 20, 30 and 60 mil thickness configurations, with others available on request. The patent-pending products are formulated to provide exceptional thickness and dielectric constant control without using inorganic fillers.
"We have seen that ceramic filled systems are tough to process due to the abrasive nature of the inorganic filler, leading to shorter drill life, lower peels and other processing issues," said Tarun Amla, VP and CTO.
Isola Group Sarl, isola-group.com
