EA-6800 microelectronic adhesives for flip-chip semiconductor packages are said to offer two-fold improvement in cure rate; EA- 6900 is specifically formulated for the high temperatures that Pb-free assemblies must endure during rework. Are RoHS compliant. Cure in about 15 min., reportedly with no loss of performance. Come in production quantities. Feature reduced voiding from residual moisture within substrates and maintain a low modulus.

 

AUTOset software subsystem incorporates KIC Vision auto-profiling and generates a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes preliminary recipes to optimize the profile. Is installed in all new XPM3 Series reflow-soldering machines. Identifies suitable oven recipe prior to running a single profile.
 

A family of SPDIP mating pin headers complements a line of SPDIP sockets. Shrink plastic packaging is said to reduce device lead spacing between pins down to 0.070" pitch. Used in memory, microcontrollers, video controllers and automotive design applications. For interconnect applications such as board stacking, socket testing and elevating circuits off the board surface. Precision-machined using brass alloy 360 and configured with pluggable tails.
 
Mill-Max, www.mill-max.com