Flotherm Version 7 electronics thermal analysis software features a response surface optimization capability. Fits a 3D surface to the entire design space. Automatically creates and runs the required number of simulations to explore the entire design space. Generates a "response surface" showing the value of the design goals for all the combinations of variables run. Said to have better design insight and intuition; rapid determination of which design parameters are crucial, and instant assessment of the effects of manufacturing variations. Applications include heat sink design; PCB component placement; fan/blower selection and the location of vents. Has the ability to embed arbitrary conductive thermal resistor networks within the overall fluid dynamics simulation. Includes a SmartPart that models heat pipes accurately and the ability to import 2D DXF files and extrude them directly into 3D shapes.
The DX-350 Series of Digital Dispenser/Controllers is microprocessor-driven and fully digital. Reportedly dispenses precise fluid volume with consistent high accuracy and repeatability. Has an operating pressure of 0-100 psi and is designed to dispense a wide range of fluid viscosities. Is equipped with user friendly, intuitive firmware. Guarantees size-shot accuracy and control of drips between cycles with a digital timer, digital pressure and vacuum readout. Has 10 programmable memories capable of storing and recalling most frequently used dispensing cycles. Operates from a 24V DC supply and is ready to use with a power adapter, air hose, sample tips, barrel, syringe adapter and syringe stand. Features a timer range of 0.0080 to 60.00s.
The T-2800 self-contained precision temperature forcing system for electronic component testing incorporates a built-in air compressor that reportedly eliminates the need for an external air supply at the test location. Has a temperature range of -60˚C to 200˚C, an airflow rate of 300 SCFH, a small footprint, and an intuitive user interface. Incorporates a receiver tank; after-cooler; water separator; a heatless desiccant air dryer; an integrated test arm, a pneumatically controlled test head, and self-diagnostics capability.
Model 40366 surface-mount accelerometer is said to have capabilities ideal for implantable medical device applications. Is a variable capacitance, silicon MEMS device designed to meet the requirements for use in implantable devices. Hermetically sealed with a shear bond strength of 1 kg; delivers repeatability of less than 0.035 pF in an SMT footprint of 2.05 x 2.90 mm configured as a three-terminal half-bridge. Features include frequency response of 40 Hz, linearity of less than 1%, transverse sensitivity of less than 1%, a +/-2g full scale for measurement of fractional-g accelerations in the presence of earth’s gravity, and over-range stops with provisions to eliminate electrostatic sticking when the accelerometer is over-ranged.
The Dow Corning DA-6534 high-performance thermal adhesive addresses the issue of overheating in advanced flip-chip BGA devices. Combines silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures. Achieves thermal resistance of 0.09 cm2 C/W at 24µ. Said to offer good dispensability. Bondline thickness can be controlled through pressure and time.
Universal Cover Tape reportedly provides optimal performance regardless of width, carrier material and equipment. The UCT peel features permit removal of the middle portion above component pockets, while adhesive edges remain adhered to the carrier. Said to simplify sealing parameters associated with current heat-activated and pressure-sensitive adhesive cover tapes, in addition to increasing productivity, reducing sealing complaints and eliminating adhesive contamination.