SN100C P810 D4 is designed for use in vacuum reflow with nitrogen. Is a high-reliability no-clean Pb-free solder paste optimized to deliver excellent reflow characteristics; generally can be reflowed with a profile similar to that commonly used with SAC 305 and SAC 405 with 240°C peak. Reduces voiding to less than 1% in measured void area. Has excellent wetting behavior. Is a compliant alloy that provides high-impact strength.
Nihon Superior, www.nihonsuperior.co.jp/english
SN100C P810 D4 is designed for use in vacuum reflow with nitrogen. Is a high-reliability no-clean Pb-free solder paste optimized to deliver excellent reflow characteristics; generally can be reflowed with a profile similar to that commonly used with SAC 305 and SAC 405 with 240°C peak. Reduces voiding to less than 1% in measured void area. Has excellent wetting behavior. Is a compliant alloy that provides high-impact strength.
Nihon Superior, www.nihonsuperior.co.jp/english
FX SL AOI inspection system reportedly has more than twice the inspection speed of previous generation systems. Magnification options include 8, 12, and 25 µm/pixel. Delivers automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is well suited for high-volume and high-mix manufacturing environments; is capable of inspecting 01005 components. Uses a standard package library.
Nordson YESTech, http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx
FX SL AOI inspection system reportedly has more than twice the inspection speed of previous generation systems. Magnification options include 8, 12, and 25 µm/pixel. Delivers automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is well suited for high-volume and high-mix manufacturing environments; is capable of inspecting 01005 components. Uses a standard package library.
Nordson YESTech, http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx
ProDEK dynamic print process control is said to enable real-time continuous alignment adjustments and cleaning frequency adaptation to enhance throughput and yield and limit operator intervention. Uses paste offset (alignment) data feeds from the SPI to monitor a configurable quantity of PCBs, sending an independently corrected forward and reverse offset to the printer, which then adjusts paste on pad alignment in real-time. Using barcode tracking technology, guarantees printed and inspected board synchronization. Monitors high area warning counts from SPI data feeds, as potential indicators of excessive or insufficient understencil cleaning. Automatically adapts cleaning frequency to suit current process conditions, optimizing understencil cleaning and introducing more stability while significantly reducing consumables usage. Retrofittable to DEK printers, and compatible with CyberOptics, Koh Young and Parmi SPI.
DEK, www.dek.com
ProDEK dynamic print process control is said to enable real-time continuous alignment adjustments and cleaning frequency adaptation to enhance throughput and yield and limit operator intervention. Uses paste offset (alignment) data feeds from the SPI to monitor a configurable quantity of PCBs, sending an independently corrected forward and reverse offset to the printer, which then adjusts paste on pad alignment in real-time. Using barcode tracking technology, guarantees printed and inspected board synchronization. Monitors high area warning counts from SPI data feeds, as potential indicators of excessive or insufficient understencil cleaning. Automatically adapts cleaning frequency to suit current process conditions, optimizing understencil cleaning and introducing more stability while significantly reducing consumables usage. Retrofittable to DEK printers, and compatible with CyberOptics, Koh Young and Parmi SPI.
DEK, www.dek.com
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