SPS Smart reflow profiler is for thermal process data collection. Collects profile data and compares it to process specifications.
ST 925 combines ST 325 programmable convective/hot air rework station, PH 100 low profile IR preheater and ST 500A Z-axis platform.
Supreme 3HTND-2DM rapid curing, toughened, one-part epoxy is for chip-on-board encapsulation using the dam-and-fill method.
ETS Series test fixtures conform to a standard size (2.50” x 2.75” square), and include mounting holes for easy stacking.
MicroHawk ultra-high definition imagers and smart cameras decode small and difficult-to-read barcodes, including data matrix 2D symbols and direct part marks used in electronics manufacturing. Can read symbols with an x-dimension as small as 0.0254mm.
Zebra 1002 Carbon Connector connects printed circuit boards to LCD displays. Includes 240 alternating layers of conductive and nonconductive silicone per inch; can accommodate contact pad spacing as close as 0.015".
Press Releases
- Mycronic High Flex changes division name to PCB Assembly Solutions; Clemens Jargon Comments
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
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- Editorial Contributions
- How Squeegee Blade Profile Helps Improve the Screen-Printing Process
- Verifying PCBA Cleanliness with Ion Chromatography
- Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization