Loctite Eccobond UF 1173 protective underfill material doesn’t contain any reportable REACH SVHCs, is not CMR classified and reportedly performs under high operating temperature environments.
Costimator 2019 cost estimating software supports estimating of hundreds of different manufacturing processes, including all forms of machining, fabrication, assembly, molding, castings, forgings and electronics.
Schroff Conduction Cooled Assembly (CCA) is designed to retain and cool printed circuit boards in environments where convection cooling cannot be used.
Temprobe nondestructive temperature sensing technology is a measurement tool used primarily for high-value assemblies.
Master Bond UV26 is a one-part UV curable system featuring glass transition temperature ranging from 160° to 170°C.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin