Circuits Assembly Online Magazine - Features

Electronics manufacturing services provider (EMS) Flextronics (Singapore) is in discussions with Nortel Networks relating to a proposed relationship, whereby Nortel Networks would divest nearly all of its remaining optical, wireless and enterprise manufacturing operations and related supply chain activities to Flextronics.

If discussions are successful, Nortel Networks' Systems Houses activities in Montreal and Calgary, Canada; Campinas, Brazil; Monkstown, Northern Ireland; and Chateaudun, France would be transferred to Flextronics.

Flextronics expects to consolidate and provide full-service supply chain offerings including printed circuit board assembly and fabrication, along with logistics and repair services supported from industrial parks on at least four different continents.

The successful completion of these arrangements would result in Flextronics undertaking and managing in excess of $2 billion of Nortel Networks annual cost of sales. Flextronics anticipates that it would pay Nortel Networks in excess of $500 million in cash over a nine-month period for certain assets.

www.flextronics.com

The PL-001-01-XX-0400-32 surface-mount technology heatsink for Dpac and D2pac is now available in a lead free version. The product is based on the placeiT technology that designs, simulates, produces and tapes special mechanical parts for surface mount technology, such as heatsinks, mechanical fixing systems and high current electrical connections for standard and custom applications.

The heatsink is based on the company's special copper alloy with a solderable surface. It is shipped in tape and reel (32 mm), weighs 4 grams and is 6.5 mm high. It is mountable with standard pick-and-place machines using standard nozzles.

The heatsink is placiT technology's first product for the mass marketplace. The company was formed in 2001 to solve a specific customer problem in an economic and automated way. The company is a cooperation of five European companies with experience in mechanics, electronics, magnetics and chemicals.

www.placeit-smt.com

Sanmina-SCI Corp. (San Jose, CA), an electronics manufacturing services (EMS) company, has reported financial results for its first quarter ended Dec. 27, 2003. The company also announced that it will begin searching for a new chief financial officer.

For the first quarter, Sanmina-SCI reported revenues of $2.97 billion, up 9%, from $2.73 billion in the fourth quarter, and up 17% from the first quarter last year.

The company reported adjusted pro forma net income of $26.2 million, or $0.05 adjusted pro forma diluted earnings per share, compared to $14.0 million, or $0.03 per share in Q4, and $6.8 million, or $0.01 per share, for the same period last year. Cash provided by operations was approximately $110 million for the first quarter.

Sanmina-SCI also reported $1.2 billion in cash and short-term investments. At quarter-end, the company reported a current ratio of 1.9, working capital of $2.1 billion and shareholders' equity of $3.3 billion.

Jure Sola, chairman and chief executive officer of Sanmina-SCI, said, "Clearly we are seeing a positive trend across all of our end-markets, orders have been increasing more steadily, and our customers are talking with a more positive and upbeat tone...This quarter, we made further progress in our original design manufacturer (ODM) strategy, adding two design wins for server products with existing original equipment manufacturer (OEM) customers."

The company also announced that its chief financial officer, Rick R. Ackel, will be leaving the company to pursue other opportunities. Ackel has served as CFO since July 2000. Sanmina-SCI will begin a search for a new CFO and in the interim Sanmina-SCI's controller, Mark Lustig, will serve as acting CFO.

www.sanmina-sci.com

Digi-Key Corp (Thief River Falls, MN) has added Murata Electronics (Smyrna, Georgia), a global supplier of ceramic passive components, to its large vendor and product offering.

Mark Larson, president of Digi-Key, said "We are cataloging, and supporting with substantial inventory, nearly 2,000 Murata components including ceramic capacitors, trimmers, resonators, thermistors, filters, inductors and potentiometers."

Digi-Key will offer customers the full line of Murata's products. Digi-Key hopes to enhance Murata's diverse distribution strategy by increasing the manufacturer's position within a variety of markets.

Murata's distribution manager, Darryl Revenew, said, "By adding Digi-Key to our list of channel partners, we can offer greater value to our original equipment manufacturer (OEM) customers. With their focus on the design and engineering communities, customers are able to purchase our products with exceptional turnaround time and superior service."

With close ties to the design and engineering communities, Digi-Key has established a strong client base focused on demand creation and is frequently sought after for sampling and fulfillment needs. Both companies will work closely to provide design enhancements (for existing and future products) to their customer base.

Digi-Key Corp.is a full service provider of electronic components. Its Website offers e online commerce capabilities along with 24/7 instant access to a broad-based, multi-million dollar product inventory. Murata Electronics is one of 47 wholly owned subsidiaries of the world organization Murata Manufacturing Co., Ltd. of Japan. Murata is a patent holder and global manufacturer of ceramic electronic components for the telecommunications, computer/peripheral, automotive, communications and EDP markets.

www.digikey.com

www.murata.com

IPC (Northbrook, IL) has announced the collection of free events planned for its co-located IPC SMEMA Council's APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition and conference, being held Feb. 24-26, 2004, at the Anaheim Convention Center, in Anaheim, CA.

In addition to the complimentary keynote addresses of Solectron president and chief executive officer Michael Cannon, industry forecaster Walt Custer and the multi-talented Bill Nye-The Science Guy, the trade show will feature eight free forums throughout the exhibition and conference. The schedule includes:

1) Beyond Lead Free-WEEE/ROHS on Feb. 24
Chair: Fern Abrams, IPC
This panel discussion will provide insights into what leading companies are doing to prepare for the July 2006 lead-free compliance deadlines along with the latest developments in legislation, exemptions and definitions of lead free under Waste Electrical and Electronic Equipment (WEEE) and Restriction on Hazardous Substances (RoHS). Additionally, the panel of experts will examine the ripple effects of this legislation on laws and regulations in the U.S. and abroad.

2) North America or Asia: Where is the Best Place for Your Manufacturing? on Feb. 25
Chair: Lisa Hamburg, Circuits Assembly magazine
The relative complexity, quantity required, circuit density, level of customization needed and delivery time frame are just a few of the issues that help determine the supply source. This panel discussion will discuss and debate the various pros and cons of overseas sources.

3) IPC PCQR2 Database-Globally Accepted de facto Standard for Comparing Process Capability, Quality and Relative Reliability of PCB Suppliers on Feb. 24
Chair: David Wolf, CAT, Inc.
The IPC D-36 Subcommittee has developed an industry standard, IPC-9151A, for process capability test panel designs and the PCQR2 database detailing the capabilities of printed circuit board (PCB) suppliers. The database provides quantitative data that allows subscribers to statistically benchmark board suppliers' capabilities; perform intelligent sourcing; select new suppliers; ensure design for manufacturability; and establish realistic design rules. The seminar will include in-depth discussions on the test panel designs, analysis reports and the capabilities of the PCB supply chain documented in the database.

4) Domestic PCB Technology Innovations at the U.S. Naval Surface Warfare Center, Crane Division on Feb. 26
Chair: Bill Payne, EG&G Crane Operations
The Emerging Critical Interconnect Technology (ECIT) program was created to co-opt military, academic and industrial extension for the purpose of facilitating North American research and development consistent with IPC's technology roadmap. This presentation will provide insight into ongoing ECIT projects, their goals, status, the participants and potential delivery schedules.

5) NEMI Defective Parts per Million Opportunities (DPMO) Project Forum on Feb. 25
Chairs: Tim Kruse, Plexus NPI Plus, and David Mendez, Solectron Texas LP
The NEMI DPMO project team is nearing completion of an investigation into package-level DPMO rates throughout the electronics assembly industry. Such DPMO data can be used to quantify the expected fault spectrum on a particular PCB assembly, enabling manufacturers to more accurately assess the cost of assembly, test, repair and scrap and also estimate the shipped product quality level of a product. Participants in the NEMI DPMO Project Team will present findings from the study, share the lessons learned and discuss the vision for follow-up on DPMO efforts in the industry.

6) Will the Real Immersion Silver Please Stand Up? on Feb. 24
Chairs: Kim Hyland and Dave Mendez, Solectron
As consumers demand more cutting-edge electronic devices, as original equipment manufacturers (OEMs) design higher functioning boards and as chemical companies make new PCB surface finishes, fabricators and assemblers need to endure the fast progression of all these changes. In this session, representatives from fabrication, assembly, OEM and chemical supply companies will answer all questions and concerns relating to the implementation of immersion silver.

7) Reactivation of IPC's OEM Council on Feb. 25
Chair: Daryl Sato, Intel Corp.
IPC is reactivating its OEM Council, which has made significant contributions to efficiency in the supply chain through development and release of standardized vendor surveys. The council's mission is to develop and use a methodology for PCB technology and assessment and advancement, evaluate PCB supplier process capabilities, identify technology gaps and monitor R&D advancements and PCB design changes to ensure gap closure. The panel will discuss their working group efforts and solicit feedback on ways to integrate and expand such collaborative projects through the OEM Council.

8) International Technology Interchange-Total Packaging Solution Roadmap on Feb. 24
Chair: Dieter Bergman, IPC
This forum will discuss global industry needs and how international organizations are involved in developing common ways of understanding future development and improving the international supply chain. The panelists will cover various topics, ranging from the definition of Jisso to the hierarchy of electronic packaging to optoelectronics and a global outlook on lead and halogen free.

For more information about these events, visit http://shows.ipc.org or contact Joe Dudeck, IPC communications manager, JoeDudeck@ipc.org.

www.ipc.org

LPKF Laser & Electronics (Wilsonville, OR) has announced the release of the low cost SL740 surface-mount technology stencil laser cutter. The system is designed for low- and medium-volume stencil production, cutting up to 3,000 apertures per hour.

The cutter uses the same proprietary high power infrared laser source compliant with laser safety class 1 as found in LPKF's higher-end models. The entry-level system provides high accuracy and reliability, making it ideal for start-up stencil businesses or a backup system for established shops. It offers a cutting area of 29 x 29 in. and accommodates all common stencils, including stencils for quick release frames. Mounting fixtures are provided for both bare sheets and framed stencils.

"With the introduction of the SL740, we are excited to better address the entry-level market space, while maintaining the signature reliability and accuracy of LPKF's products," said Stephan Schmidt, vice president of LPKF North America.

www.lpkfusa.com