Indium Corp. (Utica, NY) has introduced PK-001 and PK-002 flip chip epoxy fluxes designed for use with Sn62 and Sn 63 eutectic solders. The fast curing, halide-free, no-clean fluxes can be used for flip chip or chip-scale package (CSP) soldering processes.
The fluxes have a stable thermoset residue, compatible with standard underfill materials, conformal coatings and most finishes and coatings. They are also environmentally friendly.
Many effective methods can be used to apply the fluxes, such as pin transfer, stencil printing, dispensing or dipping techniques.
Contact Indium Corp. to obtain a copy of the product data sheets.
Indium Corporation is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Copyright 2004, UP Media Group. All rights reserved.
Plexus Corp. (Neenah, WI), a provider of electronic manufacturing services (EMS), has secured an exclusive contract with Patientline PLC to manufacture, supply and install the Patientline bedside multimedia and entertainment system.
The contract gives Plexus sole manufacturing rights over a two-year period and covers the whole of the UK. According to the agreement, Plexus will provide complete product engineering, testing, volume manufacturing and installation services for the bedside units.
The contract also includes Plexus managing the complete supply chain for Patientline from component sourcing to warehousing, logistics, installation and repairs.
The bedside unit has now been installed in over 100 hospitals throughout the UK. It brings TV, telephone, radio, email, Internet and entertainment access direct to the patients' bedside.
Copyright 2004, UP Media Group. All rights reserved.
The VIEW Engineering Inc. (Simi Valley, CA) Pinnacle is a large format non-contact dimensional measurement system for high volume, high capacity operation in production environments ranging from clean rooms to factory floors. Featuring a precision granite base and column, passive vibration isolation system, non-contact stage encoders and linear motors with exceptional acceleration and velocity performance, the system is useful for product design/development and near-line process monitoring applications in advanced manufacturing environments.
The precision metrology system is designed for dimensional measurement applications requiring the highest levels of accuracy and reliability. Its dual-magnification optical system uses two cameras for near instantaneous magnification changes. Multi-color LED illumination systems allow use of monochromatic red, green, blue, or white light for high resolution imaging.
The system features a measuring range of 250 x 165 x 100 mm (xyz) and an accuracy of U2 (xy plane) = (1.5 + 4L/1000) µm and resolution to 0.025 µm.
Applications for Pinnacle include ball grid arrays (BGA), micro-BGAs, chip scale packages (CSPs), flip-chip, multi-chip module (MCM) bump-on-die, lead frames, solder paste and chip carriers. It is electrostatic discharge (ESD) and Class 1000 clean room compatible.
Copyright 2004, UP Media Group. All rights reserved.
Northwest Analytical Inc. (Portland, OR), a provider of statistical process control (SPC) software, and ASECO Integrated Systems (Oakville, Ontario, Canada), a manufacturing consulting and system integration firm, announced a partnership to deliver a new approach to Quality Information Systems. The partnership combines off-the-shelf SPC solutions with an open, flexible, scalable database design, plus a set of integration tools that simplifies implementation, reduces integration costs, exposes all quality data and shortens project timelines.
Unlike products that typically use pre-defined database structures, the NWA/ASECO solution is tailored to meet individual customer needs, scaled to meet future requirements and can be integrated with other information systems. The database design is optimized for NWA products, minimizing configuration, training and support requirements.
The new approach is especially attractive to corporations with multi-plant operations that require scalable, reusable quality software solutions installed and serviced by an experienced systems integrator, such as ASECO. Through this partnership, a quality solution is available to all companies that need an underlying database for their NWA SPC software tools.
"Quality information systems are an integral part of the performance management environment because they provide critical process intelligence to the entire enterprise from operations management to supply chain partners," said Tom Fiske, senior analyst ARC Advisory Group. " The partnership places both companies in a strong position to solve the needs of performance-driven manufacturing organizations that require up-to-date process information to operate more effectively."
Copyright 2004, UP Media Group. All rights reserved.
LaBarge Inc. (St. Louis) reported that financial results for its fiscal 2004 second quarter and first half, ended Dec. 28, 2003, rose significantly over prior-year levels. The company also signed a letter of intent to acquire Pinnacle Electronics LLC (Pittsburgh, PA.) LaBarge indicated the acquisition will be immediately accretive to earnings.
For the second quarter, net sales rose 20% to $29,070,000, up from $24,302,000 one year ago. Net earnings from continuing operations increased 81% over last year. The quarter included a net loss from discontinued operations of $393,000, or $.02 per diluted share. Net earnings grew 267% to $1,404,000 or $.09 per diluted share, up from $383,000, or $.03 per diluted share, in the same quarter last year.
For the fiscal 2004 first half, net sales rose 24% over the first half of 2003. Earnings from continuing operations increased 169% to $2,775,000, or $.18 per diluted share. First-half results also included a net loss from discontinued operations of $102,000, or $.01 per diluted share. In total, net earnings for the fiscal 2004 first half grew 475% to $2,673,000 or $.17 per diluted share, year-on-year.
"The primary contributor to fiscal 2004 second-quarter revenues was shipments to defense customers representing 59% of sales versus 43% in last year's second quarter," said president and chief executive officer Craig LaBarge. "Bookings of new business strengthened during the second quarter from first-quarter levels, primarily attributable to orders from defense customers which represented the largest single component of second-quarter bookings. We continue to experience lingering weakness in our non-defense markets. One brightening spot is oil and gas where we have begun to see increased order activity."
LaBarge has entered into a letter of intent to acquire Pinnacle Electronics, a privately held contract electronics manufacturer that designs, engineers and manufactures printed circuit assemblies, cables and harnesses, full "box-build" assemblies and electronic/electro-mechanical systems for customers in a variety of industrial, non-military markets. Pinnacle, owned by Main Street Capital Holdings LLC, had 2003 revenues of approximately $38 million.
LaBarge expects the acquisition to be immediately accretive to earnings per share. The transaction is expected to close by the end of February and is subject to the satisfactory conclusion of due diligence, finalization of financing, finalization of definitive agreements and other customary terms and conditions.
LaBarge expects to fund the anticipated purchase price of approximately $41 million with a combination of cash on hand and bank financing.
Copyright 2004, UP Media Group. All rights reservedThe National Electronics Manufacturing Initiative (NEMI, Herndon, VA), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, is planning several meetings at IPC SMEMA Council's APEX conference on Feb. 23-26, in Anaheim, CA. Several projects will be reporting on activities in conference sessions; the recently formed RoHS Transition initiatives will hold meetings to discuss areas of focus, objectives and activities; and several of the roadmap Technology Working Groups (TWGs) will begin discussions for the 2004 NEMI Roadmap.
NEMI's Defects per Million Opportunities (DPMO) Project will be featured as one of the APEX free forums on Feb. 25. The project is nearing completion of its investigation into package-level DPMO rates throughout the electronics assembly industry. Such DPMO data can be used to quantify the expected fault spectrum on particular printed circuit board (PCB) assemblies, enabling manufacturers to more accurately assess the cost of assembly, test, repair and scrap and also to estimate shipped product quality levels. During the forum, the DPMO Project team will present findings from their study, briefly review methodology, share lessons learned and discuss their vision for follow-on DPMO efforts in the industry.
Several of NEMI's optoelectronics projects will be discussed in conference sessions. Reports from the Fiber Optic Splice Improvement Project and the Optoelectronic Substrate Cost/Performance Analysis Project are featured in a panel on optoelectronics on Feb. 26. A third optoelectronic project—the Fiber Optical Signal Performance team—has a paper session scheduled on the show floor on Feb. 26 to discuss their paper, "Degradation of Optical Performance of Fiber Optic Connectors in a Manufacturing Environment."
Several of the roadmap TWGs are holding their initial organizational meetings. The TWGs are responsible for development of roadmap chapters on specific topics and are actively recruiting industry participants. Board Assembly, Environmentally Conscious Electronics and Interconnect Substrates—Organic are all scheduled to meet at APEX.
The RoHS Transition Task Group and four initiatives organized under this group will also hold meetings that are open to non-members. These efforts were organized in late 2003 in response to findings of the 2002 NEMI Roadmap, which highlighted the need for standards for collection, documentation and transmittal of material content data of components, assemblies and systems to meet the requirements of pending regulations. The group addresses supply chain issues surrounding the transition of the electronics industry to lead-free assembly. The meeting on Feb. 26 will provide an overview of group activities and include presentations from all of the working projects as well as a panel discussion with a question and answer session.
NEMI's Board Assembly & Substrates Technology Integration Groups (TIGs) have scheduled a joint "call for participation" meeting on Feb. 24 to launch two new collaborative efforts: materials and processes for high-frequency products; and substrate surface finishes for lead-free assembly
For a complete schedule of meetings, visit http://www.nemi.org/APEXmtgs_public.pdf.
Copyright 2004, UP Media Group. All rights reserved.
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