Circuits Assembly Online Magazine - Features

The conference and tutorial program for SMT/Hybrid/Packaging show are now online at smt-exhibition.com/conference. The show, which will focus on "Technologies for the 3rd Dimensionin the Production of PCBs,” will take place May 30-June 1 in Nuremberg, Germany.

In 24 half-day tutorials, topics will encompass the complete product chain of electronic component assembly from design and process technologies to quality assurance. The conversion to Pb-free will be a principal theme in nearly all tutorials.

Five tutorials will be given in English:

Tut 06: Advanced Thermal Management Materials

Tut 07: Lead-Free Design for Manufacture Assembly Tutorial

Tut 08: Manufacturing Reliable Lead-free Electronics with High Yield - What You Should Know - Part 1

Tut 15: Lead-Free Inspection, Process Control and Defect Elimination

Tut 16: Manufacturing Reliable Lead-free Electronics with High Yield - Part 2

For information on the adjacent exhibition with over 600 suppliers, visit: smt-exhibition.com/registration

San Clemente, CA – YESTech recently won the 2006 Service Excellence Award for Test & Inspection equipment. The awards, sponsored for the 14^th year by Circuits Assembly, were presented in February, during the Apex/Expo conference in Anaheim, CA.

The SEA program recognizes companies receiving the highest customer service ratings, as judged by their own customers.

"Winning this award means more to us at YESTech than any other industry award," said Don Miller, president and CEO. "Customer service and genuine concern for our customers has been the underlying foundation of our success, and has been a commitment by every YESTech employee from the beginning. We're very proud to receive this recognition from an industry leader of the caliber of Circuits Assembly, and are extremely grateful for the support of our customers. Our pledge is to continue this high standard of customer support as we continue to grow."

NORWALK, CT – Sales of digital home entertainment gear will reach reaching $411 billion by 2010, an average annual growth rate of almost 20% over the $166 billion posted in 2005, said BCC Research.

Hubs and nodes are the largest device segment, accounting for 56% of total device sales in 2004 and 55% in 2010.

PHILADELPHIA – The American Competitiveness Institute has been awarded a five-year, $150 million contract by the U.S. Navy’s Office of Naval Research.

Under the contract, ACI will continue to operate and manage the Electronics Manufacturing Technology Center, which is already located at ACI, and perform research for electronics manufacturing technology (ManTech) programs for the Navy and other Department of Defense services.

SAN JOSE -- January bookings of semiconductor gear from North America-based manufacturers reached the highest point in 15 months, SEMI said

The three-month average basis of orders for semiconductor equipment was $1.26 billion in January, up 10% from December and 27% year-over-year.

BANNOCKBURN, IL – The January 90-day moving average shipments of all types of circuit boards rose 2.7% year-on-year, while bookings rose 10.8%, according to the latest poll of North American PCB fabricators.

The domestic book-to-bill ratio was 1.13. The ratio is based on data collected by IPC from rigid and flex producers and is calculated by dividing three months worth of orders by sales. A ratio over 1.0 is considered an indicator of rising demand.