Circuits Assembly Online Magazine - Features

NEW YORK -- Banc of America Securities says EMS demand should pick up in the second half as customers exhaust their budgets ahead of the next fiscal year.

"We still expect a second-half seasonal pick-up in demand due to corporate 'budget flush' and consumer holiday spending," said Banc of America. "On a year-over-year basis, we see mid-to-high single-digit growth in IT spending."

The analyst rated Flextronics and Benchmark as its best buys, while noting problems at Solectron and Sanmina-SCI.

HONG KONG -- Foxconn International reported first-half net earnings of $146.9 million, up 66% from $88.3 million last year. For the six months ended June 30, the ODM posted revenue of $2.35 billion, up from $1.29 billion a year ago.

Torrance, CA – Excellon Automation has opened its new corporate offices and North American production facility in Rancho Dominguez, CA. The relocation efforts will be completed by mid-October.

“Our current facility is outdated and no longer supports our North American production needs or provides the necessary capabilities for our world headquarters operations, “ said David Balsbough, president. “With our increased emphasis on customer support and technology leadership we need a facility that supports these objectives while providing efficient and flexible operating capabilities.”

TOKYO -- Sony's new CEO didn't wait long to shake up the company, as the consumer electronics giant announced plans to close 11 factories and cut 10,000 jobs from its electronics business.

Howard Stringer, the media executive whom Sony hired to revitalize its listing electronics business, said the cuts will save $1.8 billion in costs by the end of fiscal 2007. The company revised downward its forecast for the fiscal year ending in March to a net loss of $89.8 million.

AUSTIN -- Smart Modular Technologies has inked a deal to license module and package stacking technologies from Staktek Holdings.

Smart makes memory products; Staktek is a provider of intellectual property and services for chip-stacking and module technologies.

Under terms of the agreement, Smart can use Staktek's ArctiCore technology for module products, and will be licensed to offer stacking technology for leaded and BGA packages. Financial terms were not disclosed.

San Diego — KIC, Henkel Technologies, DEK, Engent, Vitronics Soltec and OK International will co-sponsor a lead-free workshop this Thursday and Friday at DEK’s facility in Schaumburg, IL.

This hands-on training program is designed for engineers and engineering management, and will provide a broader knowledge of lead-free materials interactions, and a greater understanding of the process including advantages and limitations. A sample lead-free board will be produced and taken away by each attendee. Engineering and technical representatives will be available for one-on-one discussion.

The workshop will feature hands-on production floor training in the following areas:
· Screen printing surface-mount adhesives and solder paste, and placement
· Reflow profiling
· Inspection/analytical
· Rework
· Wave.

For agenda and additional information: kicthermal.com/index.html.
Reservations must be made in advance.