News
NEWARK, NY -- IEC Electronics today said it partially recovered a nearly $400,000 writeoff the EMS firm took during its first-quarter ended Dec. 29.
The company took a $389,000 charge for outstanding receivables following the closing by Mangrove Systems, an IEC customer. However, Carrier Access Corp. has since acquired Mangrove's IP networking product assets and paid the outstanding balance, IEC said.
The company took a $389,000 charge for outstanding receivables following the closing by Mangrove Systems, an IEC customer. However, Carrier Access Corp. has since acquired Mangrove's IP networking product assets and paid the outstanding balance, IEC said.
PALO ALTO -- Hewlett-Packard, the world's top ranked PC maker, filed suit Tuesday against Acer Inc., alleging infringement on five separate
patents and seeking an injunction and unspecified damages
H-P claims Acer, the fourth largest PC maker, infringed on patents for power management, clock switching, and other technologies.
H-P claims Acer, the fourth largest PC maker, infringed on patents for power management, clock switching, and other technologies.
CONCORD, CA – Test maker Digitaltest announced 2006 sales grew in the double-digits, as production output rose 10%. The privately held company did not specify actual sales. In the US, Digitaltest had its best year, according to Mark Harding, US general manager. The company said its Grünwettersbach, Germany, facility is operating at full capacity.
ST. PETERSBURG, FL – Jabil Circuit said second-quarter revenue was $2.9 billion, up 27% year-over-year, beating analysts’ forecast of $2.83 billion. However, the company said previously announced restructuring costs would be at the high end of the estimated range of $200 million to $250 million. The top tier EMS firm forecast third-quarter revenue of $2.9 billion to $3 billion.
ENDICOTT, NY – The U.S. Department of Defense has awarded Endicott Interconnect Technologies multiple contracts totaling $164 million to produce card frame assemblies, including organic semiconductor packaging, module assemblies, printed circuit boards and assemblies, and engineering services. The company did not specify what product the assemblies would be used for. EI recommended its HyperBGA organic substrate as an alternative to ceramic semiconductor packages, leading to the module assembly business and the initial $6.5 million award. Subsequent development and collaboration lead to additional technical scope for follow-on contracts, including PCB fabrication, complex board assembly and higher level integration into card frame subsystems. Contracts totaling $37.5 million product certification, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120 million contract was awarded for the first production order of fully integrated card frame assemblies, to be delivered by year-end.
LEXINGTON, KY – EMS provider SMC today announced plans to add 18,000 sq. ft. to their current 55,000 sq. ft. facility in Lexington. The added capacity will include 16,000 sq. ft. of manufacturing space and 2,000 sq. ft. of office space. In 2005, SMC completed an expansion of 18,000 sq. ft. of manufacturing space at the same location.
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