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Press Releases

BANNOCKBURN, Ill., USA, March 6, 2017 — IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO® 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018.

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Somerset, NJ – March 6th , 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, and the Lighting Enabled Systems and Applications Center (LESA), A National Science Foundation Engineering Research Center at Rensselaer Polytechnic Institute (RPI), are pleased to announce that Gyan Dutt, Technical Marketing Manager at Alpha and Dr. Robert Karlicek, Director of LESA at RPI, have co-chaired the 2017 iNEMI Solid State Illumination Industry Roadmap.

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IRVINE, CALIFORNIA - March 2017 - Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, today announced the expansion of the SMT engineering support team for SMT business development by 140 personnel globally.

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MENTOR, OH ― March 2017 ― Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that it recently presented Future Electronics with its fourth annual Strategic Partnership Award.

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March 1, 2017, Spokane Valley, Washington – ACE Production Technologies, a Nordson SELECT company, and a leading supplier of selective soldering systems, is pleased to announce that registration is now open and seats are available for its upcoming March 14-15, 2017 introductory selective soldering workshop.

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March 1, 2017 – Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability.

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