Circuits Assembly Online Magazine - Current

Press Releases

Henkel’s development of LOCTITE ABLESTIK ICP 3535M1 was a historic breakthrough for electrically conductive adhesives (ECAs), allowing use of the material with a more diverse component range. The material provides a robust alternative to solder for many applications, lowers component assembly stress and facilitates lead-free interconnection for regulatory compliance.

Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.

Montabaur, March 2017 – iTAC Software AG has won the Experton Group’s Industry 4.0/IoT-Vendor Benchmark 2017 Award. Dieter Meuser, CTO of iTAC, accepted the award for the iTAC.IoT.Platform at a gala evening in Schlosshotel Kronberg on February 8. The Industry 4.0 platform delivers smart solutions for production process connectivity, automation and analysis.

New leadership to leverage wide-ranging experience to drive global growth initiatives.

Ashburn, VA -- Curtiss-Wright’s Defense Solutions division today announced that it has expanded its secure manufacturing capabilities for sensitive U.S. DoD aerospace and defense programs by contracting with Zentech Manufacturing, a premier electronics contract manufacturing company.

HAUPPAUGE, NY -- Orbit International Corp., an electronics manufacturer and software solution provider, today announced that its Electronics Group has received a letter subcontract from a major prime contractor for approximately $805,000, authorizing it to commence the procurement of material for displays on a major aviation program, while negotiations for the final purchase order are being concluded.