Circuits Assembly Online Magazine - Current

Press Releases

Saint-Egrève, France, January 2017 — Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will participate in the Innovations Forum 2017 – Leaders Conference, scheduled to take place March 9, 2017 in Boeblingen, Germany. Vi TECHNOLOGY company representatives will discuss how the company has coupled its 5K3D AOI with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.

Duluth, GA, January 2017 — IPC APEX EXPO, booth 3121 — At the upcoming IPC APEX EXPO, Viscom will present the latest generation of its inspection systems and solutions.

At this year’s APEX, February 14-16, San Diego, ASM Assembly Systems presents visitors with a full scale Smart #1 Factory that they can walk through and interact with.

Milledgeville, Georgia, USA – TopLine, a leading designer and manufacturer of electronic components and packaging solutions for PCB assemblies, will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments.

MADISON, AL — January 2017 — STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce that it will host an Introduction to Robotic Soldering course that will include a lecture and hands-on work with equipment in conjunction with Fancort Industries, Inc. The course is scheduled to take place on Monday, March 20, 2017 at STI’s facility in Madison, AL.

California-based circuit board manufacturer, Royal Circuits has purchased and successfully installed their second new hot air solder leveling machine from New Technology Overman (NTO) and have placed an order for a third machine to be delivered in February of this year. The new machine allows Royal Circuits to now process both tin/lead and lead free HASL in house.