ATLANTA, GA ― August 2017 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, announces that Neil Hubble, Director of Engineering, will be a panelist in the upcoming SMTAI Spotlight 5  panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.

Somerset, NJ – August 30th, 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be presenting information on its latest product innovations at a seminar hosted by ER-SA Elektrik, Alpha’s distributor partner for Turkey, in Aselsan, Turkey, on Monday the 11th of September.

Minneapolis, MN - The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.

NASHVILLE — August 2017 — KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International.