New York, New York, September 8, 2017 – BotFactory, Inc., a leader in Additive PCB Fabrication and Assembly technology will be exhibiting their new product at PCB West 2017 at the Santa Clara Convention Center in Santa Clara, California. Called the BotFactory SV2, this desktop-format machine is designed to be the essential tool for engineers, researchers, students and teachers in the Electronics field, allowing them to print and assemble PCBs on rigid or flexible materials directly from their digital PCB layout tools. BotFactory SV2 will be capable of printing 8 mil traces, 2+ layers boards and pick-and-placing of parts as small as 0402 (imperial) with a tape and reel system for 100+ components.

TORRANCE, CA — September 2017 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that Michelle Ogihara, Senior Sales & Marketing Manager, will participate in a round table discussion held by What’s New in Electronics (WNIE) TV during SMTA International. The round table, entitled, “High Time to Close the Gender Gap in STEM,” is scheduled to take place Tuesday, September 19, 2017 from 2:15-2:30 p.m.

Vision Engineering Ltd announces the loss of founder Rob Freeman, MBE, who passed away on 19th August, aged 84. Rob Freeman, born in 1933 in Singapore, grew up in Woking, Surrey, United Kingdom and was a toolmaker who worked as a race mechanic with the Jaguar Racing team in the 1950s (pictured below). He developed a borescope that enabled internal race engine components to be inspected, without taking the engine apart. This innovation led to the foundation of Vision Engineering in 1958.

Waterbury, CT., August 21, 2017 – MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, will present three technical papers at SMTA International Conference, September 17-21 held in Rosemont, IL. SMTA International is a four day technical conference, including workshops as well as a full exhibition. MacDermid Enthone Process Specialists will be presenting papers on recent relevant topics in chemical technologies for electronics manufacturing. All three will present on Tuesday, September 19. Albert Angstenberger will be presenting on copper pillar plating systems and their relationship to thermal management at 11:00 AM. Maria Nikolova will be presenting on an innovative acid copper process for simultaneous filling of vias and plating of through holes at 12:00 PM. Martin Bunce will be presenting on successful ENIG process control under new industry standards at 2:00 PM.