Somerset, NJ – May 11, 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will host a full day seminar on “Low Temperature Assembly Technology” on May 18, 2017 in Crowne Plaza Hotel in Suzhou, China.

Unique Program Teaches Electronics Manufacturing Services Staff Lean Manufacturing Principles

MC Assembly employees recently completed “Incito Man” Lean Enterprise Simulation Workshops at the company’s Boston facility.

Minneapolis, MN - The SMTA recently named Matt Bourgeois to the position of Strategic Engagement Manager. The newly-created position fulfills a need for increased engagement among corporate members, smaller manufacturers, young professionals, and students.

May 10, 2017 –   ECD is recognized globally for its pioneering work in advanced thermal process measurement technologies.  Central to the development of the company’s award-winning products are its knowledgeable people, many of whom lend their expertise to important industry initiatives. Such is the case with ECD’s Senior Project Engineer, Paul Austen, who was a member of and contributor to the standards committee that wrote the IPC-7530 “Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)”, IPC-7801 “Reflow Oven Process Control Standard”, and who also shared his expertise for the most recent revision of IPC-7530A, which was released this year.  Paul, along with other committee members, was honored for his contributions at the annual awards luncheon hosted by the IPC at this year’s APEX event in San Diego, California.