NEUSS, GERMANY – Yamaha Robotics SMT Section has announced that Roberto Ferraretto has joined the team as Area Manager for Italy, to support the Company’s range of printers, mounters, inspection systems, and software for high-speed surface-mount and hybrid assembly.

Having worked for over a decade in the electronics sector before joining Yamaha, Mr Ferraretto has applied his technical skills worldwide supporting customers and promoting high-tech products and systems. In the last five years, before joining Yamaha this month, he has held sales roles covering territories in southern Europe as well as South Africa and Israel.

He commented, “I am eager to contribute my experience to continue growing Yamaha's business in Italy. This is a great opportunty to extend my support for manufacturing here by helping customers choose the best equipment and capabilities to achieve their goals.”

“We are looking forward to working with Roberto, who combines great energy and enthusiasm with his technical understanding and record as an accomplished sales professional in Italy and internationally,” said Mr Shuichi Imai, Sales General Manager for Europe, Yamaha Robotics. “With the opportunities for high-tech manufacturing here, and his skill, there is potential for business to develop strongly among new accounts and existing customers.”

Yamaha’s automated screen printers, high-speed modular mounters, and inspection systems, with the YSUP software suite including tools for the intelligent factory, combine to create the 1 STOP SMART SOLUTION. The complete lineup offers model variants and options that let customers achieve their desired performance and features at the right price. The portfolio also includes productivity boosting accessories and innovations including automated stencil loading pre- changeover, non-stop tray feeders, Mobile Judgement app for quality assurance, one-head placement solution, and automatic component teaching and recognition.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

In addition, AIM Product Manager, Diego Jiang will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments:

High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue.​ Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA South China Expo & Tech Forum November 6-7th, or visit www.aimsolder.com 

MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping and electronic contract manufacturing, proudly announces that it has achieved ISO 13485:2016 certification, a globally recognized standard for quality management systems specific to the medical device industry. This certification underscores STI’s dedication to meeting the stringent regulatory and quality requirements necessary to manufacture safe and effective medical devices.

The ISO 13485:2016 certification demonstrates STI Electronics’ commitment to consistent excellence in its processes, ensuring that its products meet the high standards demanded by the healthcare industry. With this certification, STI is now better positioned to support its clients in the medical sector by delivering high-quality products that comply with industry regulations and patient safety standards.

“We are thrilled to receive the ISO 13485:2016 certification,” said David Raby, President & CEO of STI Electronics, Inc. “This accomplishment is a testament to the hard work of our team and our commitment to quality and regulatory compliance in the medical device industry. It also reflects our dedication to continuous improvement, customer satisfaction, and delivering products that our clients can trust.”

STI Electronics has a longstanding history of providing advanced electronics manufacturing and services to a diverse range of industries, including aerospace, defense, and now medical device manufacturing. Achieving the ISO 13485:2016 certification positions the company as a trusted partner in the medical device market, assuring customers that their products meet the highest standards of safety and quality.

CLINTON, NY – As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its innovative products and technical presentations at SMTA International (SMTAI), from October 21-24, in Rosemont, Illinois.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature soldering, contributing to a reduced carbon footprint in manufacturing processes. It is ideal for assemblies with large temperature gradient, large CTE mismatch, or components with complex warpage. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, a proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability applications. It also offers reduced solder joint cracking and increased shear strength. Additionally, it empowers automotive and infrastructure applications to achieve extended mission profiles, surpassing the limitations of SAC305 and meeting ever-evolving reliability requirements.
• CW-807RS is a no-clean formula designed to maximize the solderability of a halogen-free cored wire solder flux. The elevated wetting speeds provided by the activator package can provide lower cycle times in manual and robotic soldering processes. The spatter control technology within the flux produces an aesthetically pleasing board post-soldering by leaving minimal spattering and a clear to light-colored residue.

To learn more about Indium Corporation’s products, visit our experts at SMTAI at booth #2300.