SANTA CLARA, CA – Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), proudly announces its ITAR (International Traffic in Arms Regulations) registration, reinforcing its commitment to serving military, aerospace and defense OEM customers. Located in the heart of Silicon Valley, Absolute EMS provides advanced PCB assembly (PCBA) and box-build manufacturing solutions, supporting industries where precision and AS9100 certification compliance are critical.

With this ITAR registration, Absolute EMS is now fully authorized to manufacture and manage ITAR-compliant products, ensuring the strict handling of sensitive materials in accordance with U.S. export control laws. This registration is a key milestone for Absolute EMS, allowing the company to deepen its involvement in military manufacturing and expand its offerings to defense OEM customers.

“Our ITAR registration demonstrates our dedication to meeting the stringent requirements of the military and government sectors,” said Doug Dow, COO at Absolute EMS. “We are proud to add ITAR to our existing suite of certifications, which includes ISO 13485:2016, AS9100 Rev D, ISO 9001:2015, IPC-A-610 Class 3, J-STD-001 Class 3, and more, ensuring that our customers receive the highest level of reliability and quality.”

Absolute EMS’s state-of-the-art facility offers touchless electronics contract manufacturing, nitrogen reflow, and a satellite manufacturing model designed to enhance flexibility and efficiency. The company's capabilities serve a variety of industries, including medical manufacturing, military manufacturing and high-reliability applications, with a focus on printed circuit board assembly in Silicon Valley. Absolute EMS also operates under NAICS code 334418 and is UL Registered.

This ITAR registration further strengthens Absolute EMS's position as a high-performance EMS provider, delivering PCB assembly solutions that meet the most demanding requirements of the defense and aerospace sectors.

For more information about Absolute EMS and its ITAR-compliant services, visit www.absolute-ems.com.

FONTENAY-AUX-ROSES, FRANCE – The ICAPE Group (ISIN code: FR001400A3Q3 – Ticker: ALICA), a global technology distributor of printed circuit boards (“PCB”) and custom-made electromechanical parts, today announced its participation at the 2024 edition of Electronica, where it will present the ICAPE Shop, its new online purchasing platform.

Every two years, the main players in the electronics industry gather in Munich, Germany, to take part in the Electronica trade show, the largest event dedicated to this industry. Attending since 2002, the Group will once again be taking part alongside its industrial partners, not only to discuss their joint projects, but also to seize new business opportunities. At the last event in 2022, almost 1,000 meetings took place during the exhibition week, with nearly 700 companies. For this new edition, which will take place from November 12 to 15, 2024, the aim is to go even further, and to acquire new market share, thanks in particular to the launch of the Group's new digital tool: the ICAPE Shop.

Developed over two years, the ICAPE Shop enables customers to receive a quotation in 5 minutes, with prototypes and small series deliverable in 2 days. The Group's online service guarantees fast, secure production, with data encryption and anti-fraud monitoring. This high-quality product is based on particularly strict standards and the Group's proven expertise in this sales channel. In 2023, the ICAPE Group delivered 3.5 million PCB to 70 countries through its online platform, with production possible in 2 days.

Yann Duigou, the ICAPE Group’s CEO, stated: “We are proud to present the new generation of the ICAPE Shop to our partners at Electronica. We designed an even more effective solution to meet the needs of our customers, who generate over 40,000 quotations on our platform every year. With the launch of this innovation accessible 7 days a week, 24 hours a day, applying the strictest standards and supported by our teams available in all time zones, the ICAPE Group confirms its key position as a global technology expert in printed circuit boards supporting the digital transformation of the electronics industry."

HEERBRUGG, SWITZERLAND – Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes. This latest innovation underscores ESCATEC's commitment to pioneering sophisticated technologies that advance the electronics manufacturing industry.

The team at ESCATEC Switzerland have built a customized UV-curing system with two 365nm light sources on the die bond head of their Tresky T6000 fully automatic machine. This solution enables ESCATEC to achieve exact positioning of components and direct snap-curing required during the passive alignment process. The enhancement accelerates and improves the process of adhesive curing during the pick-and-place operations, streamlines the manufacturing process overall and boosts the accuracy of component placement, which is critical for the assembly of complex electronic parts.

Micro-assembly processes traditionally face challenges such as achieving high precision and managing adhesive curing times effectively. The UV light feature directly addresses these issues by significantly reducing the time required for the adhesive to set, which in turn, speeds up the entire assembly process.

The integration of UV light technology into ESCATEC's die bonding process brings several benefits to clients:

• Increased Precision: The precise control over UV exposure ensures accurate placement and bonding of components, crucial to produce high-quality electronic devices.
• Quality Improvement: Improved bonding techniques increase the durability and reliability of the finished products, meeting the high standards required in the electronics industry.
• New possibilities: There are some chips that need to vibrate, such as piezos, which means they must ‘float’ in the air, for which this process is perfectly suitable.

This technology holds vast potential for various applications across multiple sectors, including medical devices, automotive electronics, and industrial electronics. Each of these industries benefit from increased precision and reliability in component manufacturing, which is now achievable with ESCATEC's UV-enhanced die bonder.

"This integrated UV light into our die bonder is a game changer for micro-electronics assembly," said Wolfgang Plank, Head of the MOEMS Department at ESCATEC Switzerland. "This innovation is a testament to our commitment to leading the way in micro-assembly technology and our continuous effort to meet and exceed our clients' expectations. We are excited about the new possibilities this technology opens for current and future applications."

The introduction of the UV light feature by ESCATEC represents a significant leap forward in micro-assembly technology, reinforcing the company's role as an innovator in the electronics manufacturing industry.

ESCATEC invites industry professionals and potential customers to witness firsthand the capabilities of its new technology. For more information or to arrange a demonstration, please contact ESCATEC.

PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its participation in NEPCON Asia 2024. The event will be held at Shenzhen World Exhibition & Convention Center (Bao’an) from November 6th to 8th at Hall 9, Booth #9E20.

NEPCON Asia provides ViTrox with the ideal opportunity to showcase its latest advancements in inspection solutions in Southern China. These innovations include the V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, Industry 4.0 Manufacturing Intelligence Solutions (V-ONE) and VisionXpert Smart Code Reader Solution.

Explore the Groundbreaking Inspection Technologies of ViTrox:

The ViTrox V310i Advanced 3D Solder Paste Inspection (SPI), is designed for beginners and experienced operators. It offers enhanced solder detection capabilities through advanced technologies and comprehensive test coverage, leading to improved defect detection and optimal solder paste inspection results. The Ultra Smart Programming simplifies the parameter setup process and reduces human dependency. It provides faster programming for increased productivity, ensuring consistent and accurate solder paste inspection results. Additionally, the V310i 3D SPI streamlines the process with data-correlation features through V-ONE ONE View and its latest Advanced Closed-loop Machine-to-Machine capabilities across ViTrox’s SMT PCB Vision Inspection Platforms. The V310i 3D SPI is certified with IPC-CFX-2591 Qualified Products Listing (QPL).

Our award-winning V510i Advanced 3D Optical Inspection (AOI) incorporates Advanced Artificial intelligence (A.I.) Smart Technologies, such as A.I. parameter checker, A.I. recipe quality control, and A.I. fine-tuning, to achieve fully autonomous processes and reduce human dependency. Through AOI A.I. Smart Programming, users can achieve optimal program quality for accurate and consistent inspection results. Our A.I. integrated features are trained to comply with IPC standards when assigning algorithms. The A.I. Assisted Defect Review (A.I. VVTS) feature further automates defect verification in repair stations, delivering over 90% judgement coverage. Get in touch with our expert on-site to learn more about our powerful and robust AOI A.I. Solutions. The V510i 3D AOI has also been successfully certified under the IPC-CFX-2591 Qualified Products Listing (QPL). The V510i 3D AOI has been widely recognised for its outstanding performance, receiving multiple esteemed awards such as the 2024 New Product Introduction Award, 2023 Global Technology Award and 2023 Mexico Technology Award.

Our award-winning V810i Advanced 3D X-Ray Inspection (AXI) exceeds the conventional 3D X- Ray inspection, handling the largest and heaviest PCBs (up to 52” x 52” and 25 kg). Its innovative AXI Dual Lane solution enhances throughput by up to 50%, compared to the V810i AXI S2 Series, enabling simultaneous scanning of two boards for faster inspection. Equipped with the latest technologies and advanced inspection capabilities, the V810i 3D AXI provides comprehensive test coverage for joint inspection on PCBs with improved cycle times. With powerful 3D X-ray imaging and reconstruction methods, the V810i 3D AXI delivers high- definition, high-resolution X-ray images for accurate defect detection, especially for inspecting heavily shaded and non-uniformly shaded components. Alongside state-of-the-art test algorithms, the system offers fully autonomous process optimisation through A.I. integration, including A.I. VVTS that automates the defect buy-off process in repair stations, further boosting production yield and inspection accuracy. The A.I. VVTS covers over 90% for auto-judgement, reducing human intervention and enhancing precision across challenging and common pad inspections. Additionally, the V810i 3D AXI solution has earned IPC-CFX-2591 QPL validation, highlighting its commitment to industry-leading quality and performance standards. The V810i 3D AXI has also been acknowledged for its exceptional performance with notable industry awards, including the 2024 New Product Introduction Award and 2024 Mexico Technology Award, further reinforcing its industry-leading capabilities.

The V9i Advanced Robotic Vision Inspection (ARV) redefines flexibility in conformal coating and final assembly inspections. Its award-winning 6-axis COBOT design enables adjustable angle inspection up to 90°, reducing human judgement errors. The V9i ARV uses an Advanced CAD- less Smart Learning Algorithm to detect conformal coating defects and inspect screws, cosmetics, connectors and labels without needing CAD data. Recognised for its innovation, the V9i ARV has received the 2024 New Product Introduction Award, the 2021 Global Technology Award and the 2020 IPC APEX EXPO Innovation Award.

V-ONE, our Industry 4.0 Manufacturing Intelligence Solution, ensures seamless connectivity across the production line with real-time data visualisation. It features customisable drill-down charts and dashboards that enhance production efficiency with real-time insights and A.I. predictions. The AOI Intelligent Control Tower provides accurate data visualisation, real-time analysis across multiple lines and customised impact assessments to fine-tune production. V- ONE also monitors machine hardware and utilisation status for optimal performance.

Additionally, the ONE View feature offers data correlation across ViTrox’s SMT PCBA solutions (SPI, AOI, AXI), enabling real-time cross-referencing of inspection results and component images. With V-ONE, users gain full traceability to optimise production and ensure quality. In recognition of its cutting-edge capabilities, V-ONE was honoured with the Leadership in Smart Manufacturing Award, further reinforcing ViTrox’s leadership in Industry 4.0 technologies.

Our Innovative Integrated Industrial Embedded Solutions offer advanced capabilities to enhance production line automation. The VisionXpert Smart Code Reader (XS Series) delivers superior accuracy and efficiency in code reading. Additionally, our comprehensive solutions include Stepper Motor Controller & Driver Solutions, Light Source Controllers, High-speed I/O Cards and Light Source Customisations, providing a robust foundation for automation.

Don’t miss this incredible opportunity to connect with us at NEPCON Asia 2024! ViTrox’s experts will be on-site, ready to address all your questions and ensure a productive visit to our booth. Secure your preferred appointment time by registering through the registration link to meet with our field experts in person. For more information about our solutions, contact us at enquiry@vitrox.com