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Press Releases

Rohnert Park, CA – July 23, 2019 – Masterwork Electronics, (“Masterwork”), a top manufacturer of printed circuit board assemblies (PCBA), which is backed by Hidden Harbor Capital Partners, today announced the appointment of Bhawnesh Mathur as its new Chief Executive Officer. Founded in 1994 to meet the increasing worldwide demand for PCBA and Cable & Harness Assembly, Masterwork Electronics is today one of the premier Electronics Manufacturing Service (EMS) providers.

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Minneapolis, MN - The SMTA is pleased to announce the release of the 2019 Young Professionals Benefits Book. The Benefits Book encompasses six key benefits available to Student and Young Professional members at no additional cost.

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President Trump announced the administration and congressional leaders have reached agreement on a deal to raise federal spending levels and extend the debt limit for the next two years. SIA is encouraged by this announcement and urges policymakers to prioritize research funds during the appropriations process to keep America the world leader in semiconductor technology.

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Washington, D.C. – The Trump administration this week is praising IPC – Association Connecting Electronics Industries and several of its member companies for their efforts to expand the skilled workforce.  

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The Directors and Shareholders of H K Wentworth, the parent company of Electrolube and AF International, are very pleased to announce the appointment of Robert Crosby-Clarke to the Board of Directors as Commercial Director. Robert has devoted an impressive 24 years of service to the company and prior to this promotion held the positions of European General Manager for Electrolube and AF International followed by European Brand Director for Electrolube.

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San Diego — July 2019 — KIC announced that MB Allen, Manager for KIC’s Applications & Sales, will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, Aug. 22, 2019 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD. Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

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