Press Releases
NASHVILLE — July 2019 — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. KYZEN cleaning experts will discuss the newest addition to the award-wining AQUANOX product line: AQUANOX® A4727 Next Generation Aqueous Assembly Cleaner.
July 2019 – Motion Sensors, Inc. (MSI), a leading supplier of speed sensors since 1970, has successfully installed an OC-SCAN®CCX.3 automated X-ray component counter from Optical Control. The CCX.3 is directly connected with their component storage tower and ERP system, and can now precisely manage their inventory with incredible time savings and accuracy.
Test soldering and prototype production with expert support from application experts from Rehm Thermal Systems
MADISON, AL — July 2019 — STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, in cooperation with lead author Mike Bixenman, DBA, KYZEN, and other contributors, announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).
CAVE CREEK, ARIZ. (PRWEB) JULY 25, 2019 High Density Packaging (HDP) User Group is pleased to announce that Gen3 has become our newest member.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing