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Press Releases

CHATSWORTH, CA – September 18, 2018 – NEO Tech, a leading microelectronic and RF solutions provider for defense contractors and U.S. government agencies, announces that it received reaccreditation by the Department of Defense, Defense Microelectronics Activity (DMEA), furthering its reputation as a leader in the microelectronics industry.

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Somerset, NJ – September 17, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be hosting a full day seminar on “Low-Temperature Soldering Technology” at Hyatt Regency Dongguan in China on September 19, 2018.

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Manchester, NH – September 17, 2018 – SemiGen, Inc. (www.semigen.net), an ISO and ITAR registered outsource for RF and Microwave contract assembly, automated PCB assembly (PCBA), wafer-processing, and key diodes, semiconductor devices, and bonding supplies, is pleased to announce that after moving into their new state-of-the- art facility, they’ve made an additional capital investment of over a half million dollars in new production, wafer fab, and testing equipment to support customer demand.

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Chino, CA — September  2018 — Scienscope International, a leading American supplier of cabinet style micro-focus X-ray systems, announces that Don Jeka will present at the Restronics Northern California Technology Showcase, scheduled to take place Wednesday, September 19, 2018 at the Embassy Suites in Milpitas, CA. Jeka will present: “How accurate Component Counting Can Improve Inventory Management and Save Time and Money in the Production Environment.”

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Haverhill, MA, USA September 2018. Seica Inc., will be exhibiting at the SMTAI trade show to be held in Chicago, IL on October 16 – 17, 2018. Seica’s Pilot V8 automated flying prober will be on display in booth #424. The Pilot V8 Next> series is Seica’s latest innovative flying prober on the market today. It’s ability to test traditional loaded boards is unmatched in today’s market, but also its ability to test wafers, substrates, MLOs and assemblies is quite extraordinary.  From NPI pilot runs to full production runs, with its fast ICT test capabilities the system can also be configured to regenerate netlists and schematics for circuit assemblies that have no data whatsoever. The system can also be configured for functional testing such as; power up, boundary scan, flash programming, and LED testing or using Seica’s functional language the user can create their own test code or run  National Instruments TeststandTM Labview sequences. Seica will also discuss many other product offerings from bed of nails testers, to automation equipment, conformal coat and THT (Dragonfly) test systems, and our laser based selective solder system called the Firefly.

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October 18-19

BEST announces that Phil Zarrow, electronics industry subject matter expert, will be our guest lecturer for the SMT Boot Camp to be held October 18 - 19. This course will feature the entire assembly process: board fabrication, print, place, reflow, clean, test and coating. In only the way Phil can, real world examples will be presented in the 2 day lecture.

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