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Press Releases

Enables PKI Certificate Deployment in Hardware Based Secure Elements and Secure MicroControllers

Redmond, WA, September 18, 2018 – Data I/O Corporation (NASDAQ: DAIO), a leading global provider of advanced data programming and security provisioning solutions for flash-memory, flash based microcontrollers, secure elements and authentication ICs and DigiCert, the world’s leading provider of scalable PKI solutions for identity and encryption, today announced the companies are partnering to enable secure provisioning of semiconductor devices for IoT applications on Data I/O’s SentriX Secure Provisioning System.

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[New Britain, CT] MicroCare Corp. announced today that it is has achieved ISO 9001:2015 certification. This accomplishment indicates that MicroCare products are developed, engineered, manufactured and delivered using the latest and most advanced quality management processes. The older standard, ISO 9001:2008, has been rendered obsolete by the new standard and is being discontinued.

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September 19th, 2018 ― Cranston, Rhode Island USA - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at Productronica South China, scheduled to take place October 10-12, 2018 at the Shenzhen Convention Center in Shenzhen, China. AIM will highlight its REL electronic solders, REL22™ and REL61™, along with their full line of solder assembly materials.

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Manassas, VA – September 11, 2018 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host the LED Cleaning and Reliability” webinar on Thursday,  September 27th, from 1:30 PM to 2:30 PM EDT.  This is the seventh installment of the ZESTRON Academy 2018 Cleaning Webinar Series, and will be presented by Senior Application Engineer, Ravi Parthasarathy, M.S.Ch.E.

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Seoul, South Korea – Koh Young Technology, the pioneer and leader in 3D inspection technology, showed the latest Meister-D for the SiP (System-in-Package) assembly process. This innovative technology was recently highlighted at SEMICON Taiwan in the Taipei Nangang Exhibition Center.  

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Chester, Connecticut, USA – Ascentech, LLC will will be exhibiting its GEN3 Systems Ltd. technology solutions as well as Inspectis AB products at SMTA International 2018 (SMTAI), October 16-17 at the Donald Stephens Convention Center, Rosemont, IL, USA. Ascentech’s booth is #723.

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