•    The latest products for semiconductor packaging will be demonstrated in Booth E3451

Aylesbury, Bucks, UK – 17 June 2020 -- Nordson Corporation (NASDAQ: NDSN) announces that six product lines from its Nordson ELECTRONICS SOLUTIONS division will be exhibiting together at SEMICON China, the world's most well-known semiconductor industry exchange and trading platform, to be held June 27-29, 2020 at the Shanghai New International Expo Center and Shanghai Kerry Hotel Pudong, in booth E3451.

June 16th, BOLD Laser Automation, Inc. of Bedford, NH USA, announces the shipment of a LPW2424 Laser Precision Welding System during the second quarter of 2020.  This represents the third unit of this flagship LP product line to ship this year.  The LP series provides system configurations for clients who need production ready platforms for welding, soldering and cutting applications.

June 2020 – MIRTEC is pleased to announce that Out of the Box Manufacturing has purchased an MV-6 OMNI to meet their ongoing commitment to continuous process improvement. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable OBMFG to provide their customers with flawless manufacturing quality and consistent on-time deliveries all at a competitive price!

AUSTIN, TX – June 2020 – Critical Manufacturing, an ASM PT company, is pleased to announce the appointment of SDG S.r.l. as its manufacturers’ representative for the SMT and Electronics Assembly Market in Italy, Malta and Albania. SDG will be acting as a referral partner for the company in the region.