San Diego — February 2021 — KIC is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org.

Marietta, Georgia, USA – Yamaha Motor Corporation USA‘s Intelligent Machinery (IM) Division is pleased to announce the appointment of Michael Helin to Senior Automation Engineer of the Robot Operations FA (Factory Automation) Department.

NORTH BILLERICA, Mass., February 2021 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.

SAN JOSE, Calif., Feb. 22, 2021 /PRNewswire-PRWeb/ -- NexLogic Technologies, Inc., an EMS provider offering both PCB SMT and microelectronics assemblies, announces the installation of a highly advanced Finetech FINEPLACER lambda sub-micron die bonder system in its PCB microelectronics assembly line. According to the manufacturer, Finetech, the new die bonder has accuracies of 0.5 µm and is designed for precision die attach and advanced chip packaging.