Elk Grove Village, Illinois, USA – 08 April 2022 – Pillarhouse USA Inc. today announced the appointment of WITTCO Sales Group to lead sales efforts in the Southern California, Southern Nevada, and Baja Mexico Regions. Adrian De’Ath, Vice president for Pillarhouse USA Inc stated’ “We are thrilled to announce WITTCO have joined the Pillarhouse sales representative team with an extensive background in the electronics manufacturing industry. We are confident that WITTCO will be able to provide our customers 1st class sales and engineering support.”

Pillarhouse is a world leader in the design and manufacturing of high quality flexible selective soldering systems from entry level hand-load (batch) processes to fully automated high-speed lines. Pillarhouse manufactures a wide range of modular and hand load equipment to fit the changing marketing market needs of today. WITTCO Sales was established in 1989 to provide a technical conduit between Manufacturers of electronic production equipment and their intended market users. CEO Tom Wittmer of WITTCO Sales stated “We are incredibly pleased and look forward to offering Pillarhouse within our strong brands of PCB assembly solutions. From entry level to highly customized complex systems, Pillarhouse has a long pedigree of high quality and low cost of ownership selective soldering equipment”

About Pillarhouse International Ltd

Pillarhouse has been a leading force in the selective soldering of today’s modern machines; offering a range of machine options to cover the wide variety and complexity of today’s modern electronics. Our philosophy is to produce high engineering standard products with a focus on innovation and cutting-edge development. With Headquarters in Chelmsford – UK alongside supplementary Manufacturing, Sales/Service facility in Suzhou – China and Sales/Service support in Chicago – USA. Pillarhouse has developed into a Global Company with Sales and Service facilities in over 50 countries.

About WITTCO Sales

WITTCO Sales Inc. is a Manufacturers’ Representative company serving the Sothern California, Southern Nevada and the Norther Baja Mexico regions over 30 years with an emphasis on the Electronics and Industrial Assembly markets. No matter your company’s production tools and equipment needs, WITTCO is able to provide a Best-In Class line of products and technical assistance you may require. Contact Todd Wittmer at Toddwittmer@wittcosales.com or visit https://wittcosales.com for more information.

Sudbury, MA April 2022 – DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, recently developed an innovative process technology combining adhesive dispensing and preactivation in a single process step. Activation on the flow provides users with new options for designing their products and processes while reducing costs and CO2 emissions.

Ideal for bonding and encapsulating temperature-sensitive electronic components, this new technology offers an alternative to bonding processes previously used in industry.

Unique Technology

The adhesive is already irradiated during the dispensing process, which starts the curing reaction even before the adhesive meets the component. After the combined process step, the components can be joined. Another unique feature of the technology is that the exposed adhesive areas can be additionally irradiated and fixed after joining. This provides immediate initial strength, preventing the adhesive from flowing out and the components from slipping, while allowing them to be further processed right away. The adhesive cures reliably to final strength whether or not there is additional light fixation. No additional process steps are needed, even in undercuts and shadowed areas.

The one-component adhesives, developed specifically for activation on the flow, are based on epoxy resin. The patented DELO KATIOBOND FA adhesives contain two different initiators that react to different wavelengths and initiate curing. This dual-initiator system is what makes the optional light fixation step possible. The adhesives are available with different mechanical properties and are highly resistant to media and temperature in the cured state.

Dispensing and Irradiation

DELO has also developed the appropriate device DELO-ACTIVIS 600. It is made up of two subunits, one for dispensing and one for irradiation. Dispensing is done on a volumetric basis, with flow rate and quantity defined according to process requirements. As the one-component adhesive passes through the mixing tube, it is irradiated by integrated DELOLUX 503 curing lamps. The mixing coil ensures uniform activation of the entire adhesive volume. DELO-ACTIVIS 600 can be used as a stand-alone device or integrated into existing production systems.

“With activation on the flow, we have developed a complete system combining process technology, adhesive and device, which enables innovations on the customer side,” said Dr. Karl Bitzer, Head of Product Management at DELO. “The various customizable parameters open up completely new possibilities in terms of component design, efficient processes, and CO2 reduction.”

Activation on the flow is well-suited for bonding and encapsulating temperature-sensitive components. For example, sensors or connectors can be bonded in a ‘gentle’ way and with low stress using dual-initiator adhesives. None of the components need to be transmissive to light, and the adhesive cures reliably even in complex geometries.

This new technology can replace various bonding processes widely used in the industry. It is an efficient and environmentally friendly alternative for heat-curing, room-temperature-curing, or dual-curing processes. It helps to overcome previous limitations and creates room for innovation.

April 5, 2022 ― Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce Andres Lozoya has been awarded Lean Six Sigma Black Belt.

Read more ...

Kennesaw, Georgia, USA – Yamaha Motor Intelligent Machinery (IM) offers the fastest 3D automated optical inspection on the market today in the YRi-V hybrid 3D multi-purpose AOI system. Designed to serve all markets that require ultra-high speed and precision 3D inspections, YRi-V systems feature mounted coaxial lighting and 12um, 7um, 5μm lense options that support high-accuracy and high-speed performance.

The YRi-V can achieve 56.8cm2/sec. inspection speeds under optimum conditions, with accuracy ensured by its 8-way projectors and 4-way oblique imaging through its 20 Megapixel angle cameras. Lens/coaxial lighting options ensure very high resolution, well-suited to device inspection. Notable features include the following:

• New 5um resolution for narrow pitch 0201mm devices;

• New co-axial lighting system for finding defects in reflective surfaces;

• New camera and projector system that offers improved inspection capability;

• New AI supported easy programming and job creation;

• New unified YR platform machine interface.

Most notably, YRi-V can convey large PCBs, with L610mm and W610mm dimensions as standard. The dual lane system can convey large PCBs with W320mm on the two lanes. Additionally, the newly- developed Dual Lane system can operate dynamically with 1 fixed and 3 moving rails. The system can be easily connected to upstream and downstream equipment; this contributes to establishing dual lane flexibility.